Plastic packaging advantage:
1. Plastic packaging metal substrate board has good heat dissipation capability and can withstand high and low temperature shock.
2. Applied system-on- chip to make product size smaller, power consumption lower, reliability higher, performance improved and security enhanced.
3. It is convenient to assemble which is suitable for spot welding, soldering and good for automatic assembly.
4. Outstanding insulation and anti-static property
5. High mechanical strength, moisture-proof, anti-corrosion resistance, flame-retardant, which is easy to transport.